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Work cover

MEMS packaging

  • Tai-Ran Hsu

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Genres

  • Microelectromechanical systems
  • Microelectronic packaging
  • Microsystèmes électromécaniques
  • Mise sous boîtier (Microélectronique)
  • Bauelement
  • Mikroelektronik
  • Mikromechanik
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About the author

  • Tai-Ran Hsu

    5.00

    1 ratings · 9 works

Editions

  • Edition cover

    INSPEC

    2004

  • Edition cover

    INSPEC

    2004

  • Edition cover

    Institution of Engineering & Technology

    2004